The is more than a reference—it is a strategic asset for uptime and yield. Without it, you are navigating a €200,000+ machine blindfolded.
: Standard 0°–360° rotation. Optional heated bond heads (up to 450°C) and UV Curing (365 nm & 405 nm) are available.
: Handles wafer sizes from 2" to 12" and substrate areas up to 13" x 8" (325 mm x 200 mm).
The is more than a reference—it is a strategic asset for uptime and yield. Without it, you are navigating a €200,000+ machine blindfolded.
: Standard 0°–360° rotation. Optional heated bond heads (up to 450°C) and UV Curing (365 nm & 405 nm) are available. Datacon 2200 Evo Manual Pdf
: Handles wafer sizes from 2" to 12" and substrate areas up to 13" x 8" (325 mm x 200 mm). The is more than a reference—it is a