The IEC 60352-5 standard is the global benchmark for press-fit technology in electronics manufacturing. It defines the requirements, test methods, and practical application rules for compliant press-fit connections. As printed circuit boards (PCBs) become denser and more complex, understanding this document is essential for engineers aiming for high reliability without the thermal stress of soldering.
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IEC 60352-5 defines the general requirements, test methods, and practical guidance for solderless press-in connections. A press-in connection is created by inserting a termination (a "press-in zone") into a hole on a board—often a plated-through hole in a PCB—relying on mechanical friction rather than molten solder to create an electrical bond. Why Switch from Solder to Press-Fit? According to insights from Bead Electronics Positronic The IEC 60352-5 standard is the global benchmark
: Offers superior performance in high-vibration and thermal cycling environments, common in automotive and aerospace sectors. Ease of Rework The IEC 60352-5 PDF document is relevant to
: Focuses on the connection performance once implemented into a specific component or board assembly. Where to Get the Standard
is an international standard published by the International Electrotechnical Commission (IEC). Its full title is "Solderless connections – Part 5: Crimped connections – General requirements, test methods and practical guidance."
The primary objective is to verify that press-in terminations are mechanically sound, electrically stable, and environmentally durable. It ensures that results remain comparable even when different manufacturers or tooling designs are used. EN 60352-5:2008 - Solderless connections - Part 5: Press-in